New applications of r.f.-sputtered glass films as protection and bonding layers in silicon micromachining
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چکیده
Ddferent r f-sputtered borosdlcate glass films are characterized Layers sputtered m 100% AI and annealed m Nz at 550 “C for 3 5 h are found to be best applicable as protection layers m amsotropx etchmg of SI m KOH solutions and as bondmg layers m s&on mlcromachmmg For m SUB mspection of the progress of the dxonto-&con anodlc bondmg process usmg sputtered glass as mtermedlate layer, an Infrared mspectlon eqmpment 1s built Also, an alternatwe evaluation method of the bonding quahty IS presented Bondmg expenments mth sputtered glass layer thicknesses rangmg from 20 to 1000 nm show correspondmg progress of the bondmg process The peld does not seem to depend on the thickness of the borosdlcate layer Furthermore, new possible applications are demonstrated, m which the sputtered glass layer acts both as an etch stop and bonding layer
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